Environmentally stable, highly conductive gold clad powders for conductive filler applications. E-Fill™ gold clad powders offer significant cost saving over pure gold powders without reducing performance.

Sulzer Metco currently supplies a variety of gold-coated materials into the electronics market. Ni-Au clad composite powders offer significant cost savings and performance benefits over traditional gold-based conductive polymer additives for use in electronic packaging applications. Sulzer Metco’s flexibility in material design ensures that performance and cost targets for your product are met.

By using Sulzer Metco E-Fill™ gold materials, your company can realize significant cost savings and while meeting rigorous performance targets. Our composite materials offer significant cost savings over pure gold without reducing performance. To further optimize cost and performance, low-density and non-spherical core materials can be used.

Sulzer Metco's integrated manufacturing ensures superior product performance, consistency and control. Our proprietary, flexible manufacturing process enables the filler's gold content, density, morphology, composition, size and shape to be highly controlled, thereby optimizing performance targets for the end product.

Sulzer Metco's proprietary nickel coating process produces a ferromagnetic pure nickel coating. These ferromagnetic properties are maintained through the gold coating process resulting in a coated composite material that can be magnetically manipulated to optimize the orientation of the material when loaded.

Custom materials are also available upon request.