Conductive Fillers

E-Fill™ conductive filler materials excel in EMI/RFI shielding applications
Sulzer Metco's E-Fill™ conductive fillers are used in coatings, inks, adhesives, tapes, EMI gaskets, elastomers and sealants to provide exceptional EMI/RFI shielding, conductivity and heat transfer capabilities. E-Fill™ is ideally suited for applications in electronic devices. Sulzer Metco's proprietary hydro-metallurgical process ensures a nickel coating that is continuous and uniform resulting in a highly conductive filler material.

Conductive Additives for EMI Gaskets


E-Fill™ nickel graphite materials offer the shielding effectiveness of silver clad fillers at a fraction of the cost. Our nickel graphite materials are optimized as required for use in molded, extruded and form-in-place applications.
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Nickel Powders


Our highly controlled conductive nickel powders for use as core materials or in conductive filler applications. Our manufacturing processes ensure consistent particle shape and morphology for excellent consistency in your application.
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Nickel Gold Conductive Fillers


Environmentally stable, highly conductive gold clad powders for conductive filler applications. E-Fill™ gold clad powders offer significant cost saving over pure gold powders without reducing performance.
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